Trademarks The information herein is subject to change without notice. Attention has been paid to the specific nature of circuit-simulation problems to ensure that optimal parallel efficiency is achieved as the number of processors grows. These include serial, shared-memory and distributed-memory parallel platforms.
Xyce is a parallel code in the most general sense of the phrase - a message passing parallel implementation - which allows it to run efficiently a wide range of computing platforms. Object-oriented code design and implementation using modern coding practices. Device models that are specifically tailored to meet Sandia's needs, including some radiation- aware devices (for Sandia users only). This allows one more » to develop new types of analysis without requiring the implementation of analysis-specific device models. A differential-algebraic-equation (DAE) formulation, which better isolates the device model package from solver algorithms.
This includes support for most popular parallel and serial computers. This development has focused on improving capability over the current state-of-the-art in the following areas: Capability to solve extremely large circuit problems by supporting large-scale parallel com- puting platforms (up to thousands of processors). Xyce has been de- signed as a SPICE-compatible, high-performance analog circuit simulator, and has been written to support the simulation needs of the Sandia National Laboratories electrical designers.
This manual describes the use of the Xyce Parallel Electronic Simulator. Contacts Bug Reports (Sandia only) World Wide Web (Sandia only) Email (outside Sandia) (Sandia only) = , All other trademarks are property of their respective owners. The EKV3 MOSFET model was developed by the EKV Team of the Electronics Laboratory-TUC of the Technical University of Crete. Xyce 's expression library is based on that inside Spice 3F5 developed by the EECS more » Department at the University of California. Amtec and TecPlot are trademarks of Amtec Engineering, Inc. Medici, DaVinci and Taurus are registered trademarks of Synopsys Corporation.
Microsoft, Windows and Windows 7 are registered trademarks of Microsoft Corporation. Orcad, Orcad Capture, PSpice and Probe are registered trademarks of Cadence Design Systems, Inc. Written by Alan Hindmarsh, Allan Taylor, Radu Serban. Produced at the Lawrence Livermore National Laboratory. Portions of the Xyce TM code are: Copyright c 2002, The Regents of the University of California.
Xyce TM Electronic Simulator and Xyce TM are trademarks of Sandia Corporation. Copyright c 2002-2015 Sandia Corporation. Users who are new to circuit simulation are better served by the Xyce Users' Guide. This document is not intended to be a tutorial. The focus of this document is (to the extent possible) exhaustively list device parameters, solver options, parser options, and other usage details of Xyce. Applications have also been demonstrated for mapping net radiation and potential evaporation over three dimensional surfaces, with the mapping of actual evaporation also demonstrated for a case study meeting specific constraints.This document is a reference guide to the Xyce Parallel Electronic Simulator, and is a companion document to the Xyce Users' Guide. The use of the new model, integrated with existing evaporative models, was demonstrated by comparison to field measured actual evaporation data. The new model for net radiation over a three dimensional surface was designed for engineering application, and for simple integration with existing models of evaporation and flux boundaries on soil covers.
A sensitivity study was also conducted to evaluate model parameters. Statistical analysis of the field data showed that the model could predict net radiation on sloped surfaces with good accuracy for engineering applications. A model for the prediction of net radiation over a three dimensional surface was developed, and verified with field experiments. This thesis examines moisture fluxes through soil covers in three dimensions, with a particular focus on the variations that occur in evaporation over a three dimensional (sloped) surface. While the flux of moisture through soil covers has been well investigated for horizontal soil surfaces, there has been relatively little research on applications to sloped surfaces. The flux of moisture through a soil cover is one of the key parameters defining its performance. Soil covers are commonly used to isolate waste materials from the surrounding environment.